Objective·Application Precious Metal Film Deposition Electrical Relay and Connection Technology Joining and Precision Technology Circuits • Mounting Technology D-1 Printed Circuit Boards High speed Boards High density boards Blind Through-hole Boards Thick Copper Foil Boards (conductor thickness 105 to 210μm for power supplies) Partially gold plating boards Thin Plate Boards (4-layer 0.40mm thick, 6-layer 0.5mm thick) Probe Boards (up to 6.5mmt), Socket Boards Countersunk Boards (lighter, thinner, shorter) COB (chip on board) Boards Build Up Boards Low-alpha (coefficient of thermal expansion) Boards (for mounting TSOP components) Metal Core Boards (for heat radiation) Metal Base Boards (for heat radiation) Coil and Transformer Boards POH boards (pod on the via, embedded heat sink) Environmental PWBs Equipment and Measuring Devices Catalysts and Compounds Precious Metal Recycling		High speed Boards High density boards Blind Through-hole Boards Thick Copper Foil Boards (conductor thickness 105 to 210μm for power supplies) Partially gold plating boards Thin Plate Boards (4-layer 0.40mm thick, 6-layer 0.5mm thick) Probe Boards (up to 6.5mmt), Socket Boards Countersunk Boards (lighter, thinner, shorter) COB (chip on board) Boards Build Up Boards Low-alpha (coefficient of thermal expansion) Boards (for mounting TSOP components) Metal Core Boards (for heat radiation) Metal Base Boards (for heat radiation) Coil and Transformer Boards POH boards (pod on the via, embedded heat sink) Environmental PWBs

© 2004 Tanaka Kikinzoku