Tanaka Kikinzoku Group Products Guide
Top Page Objective·Applications Contents by Industry Precious metals phyisical properties data
Objective·Application
Precious Metal Film Deposition
Electrical Relay and Connection Technology
Joining and Precision Technology
C-1 AuSn Alloys for Brazing Assembly
C-2 High-purity Materials for Evaporation and Bonding
C-3 Precious Metal Brazing Filler Metals
C-4 Active Brazing Filler Metals
C-5 Sheets, Wires and Powders
Circuits • Mounting Technology
Equipment and Measuring Devices
Catalysts and Compounds
Precious Metal Recycling


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C-4 Active Brazing Filler Metals


Superior results for direct ceramic brazing.
Brazing compounds capable of bonding to ceramics, whether oxide or nitride types. Until recently, direct bonding between ceramics and the joining of ceramics and metals had not been possible, but we now produce firm and stable joints without metallized layers.
Features
Direct bonding of ceramics without metallized layers.
Joints are at least as strong as those using previous methods.
Able to reduce cracking from thermal expansion differences between metal and ceramic.

Types
Product
Component
Solidus°C
Liquidus°C
Form
Dimensions
TKC-710
AgCuTi Series
Approx.780
(Sheets)
Width: up to 110mm
Thickness: 0.1mm or more
TKC-591
AgCuTi Series
Approx.610
Approx.710
(Sheets)
Width: up tp 110mm
Thickness: 0.04mm or more
Width: up to 110-150mm
Thickness: 0.1mm or more
SP-641
AgCuTi Powder
+Media
Approx.780
(Paste)
Particle Size: up to 50μm
SP-501
AgCulnTi Powder
+Media
Approx.610
Approx.710
(Paste)
Particle Size: up to 50μm

Cross Section View of Brazing layer
Cross Section View of Brazing layer

Applications
Joining ceramic jigs, engine components, electronic components for ceramic radiators, ceramic wiring boards, etc.


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