| • |
Au- and Au alloys are available in shapes of Wire, Ribbon, Pellet and Block. |
| • |
Removal of involved air and oxidized additives. |
| • |
Availability of Bonding Ribbon(4NAu) having a narrower width such as 50 μm within the accuracy of ±5 μm. |
 Typical Composition and Shape |
Mass% |
Shape |
Wire |
Ribbon |
Pellet |
Block |
Au (4N, 5N) |
|
|
|
|
Au-Sb1 |
|
- |
|
|
Au-Zn5 |
|
- |
|
|
Au-Si3 |
|
- |
|
|
Au-Ge12 |
|
- |
|
|
Au-Be1 |
- |
- |
- |
|
|
Die-bonding, for wafer evaporation, etc.
|
