|
 |
|
These alloys are suitable for bonding RF devices and optical communication devices.
They can be used as substitutes for high temperature Pb free solders.
We can supply not only brazing filler metals but also sputtering targets, and vapor deposition materials. And also we can supply fusion products, which are pre-brazed AuSn solder materials on metal or ceramics pieces according to required quantities. |
|
| • |
Available in composition which suits each required condition. |
| • |
Improves Au rich structure. |
| • |
Superior hermetic property with no void. |
Composition |
Solidus °C
Liquidus °C |
Hardness (Hv) |
Specific Gravity |
Au-Sn20 |
278°C |
118 |
14.52 |
Au-Sn21 |
278°C |
118 |
14.52 |
Au-Sn90 |
217°C |
16 |
7.78 |
|
| Other compositions are available. |
Shape |
Minimum Dimension |
Ribbon |
20μmt |
Preform |
20μmt |
Ring |
20μmt |
Vapor deposition material (wire) |
0.5mmφ |
Vapor deposition material (ball) |
0.1mmφ |
Sputtering target |
2.5mmt |
|
Semiconductor laser modules, Optical devices, SAW liters, Microwave radar components, Lead frames, Lead pins, Ceramics packages, etc..
| • |
Improves Au rich structure. |
| • |
Fusion process is available on ceramics, also metalized thin films, and conductive surfaces. |
| • |
Realizes excellent precise dimensions with most up-to-date facilities. |
| • |
Reduces assembly processes and improves products yields. |
 Example of improved Au rich structure
* SEM Images of cross section of AuSn fusion layer on Au (plating) /Ni (plating) / Kov |
|
|
 |
Fusion process on materials provided from customers.
•On conductive surfaces of ceramics.
•On heat sinks or lead frames.
•On semiconductor devices or compound devices. |
 |
Hermetic seal caps (plates, drawn pieces) on. . . ceramics, or on metals |
 |
Lead pins (Ni/Au plating) . . . on Kov, Cu, Fe etc. |
|
|
