Tanaka Kikinzoku Group Products Guide
Top Page Objective·Applications Contents by Industry Precious metals phyisical properties data
Objective·Application
Precious Metal Film Deposition
Electrical Relay and Connection Technology
B-1 Cross Bar Contacts
B-2 Contact Welding Process
B-3 Precious Metal Spring Contacts
B-4 Rivet Contacts
B-5 Bonding Wires
B-6 Bumping Wires
Joining and Precision Technology
Circuits • Mounting Technology
Equipment and Measuring Divices
Catalysts and Compounds
Precious Metal Recycling


Tanaka Kikinzoku Group
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Price Information
Electrical Relay and Connection technology
B-1 Cross Bar Contacts

B-2 Contact Welding Process

B-3 Precious Metal Spring Contacts
Multi-wire Brush Contacts
Scratch-type Brush Contacts
Slip Rings

B-4 Rivet Contacts

B-5 Bonding Wires
Gold Bonding Wire
Gold Alloy Bonding Wire
HF (Hand Free) Case
Al-1%Si Bonding Wire
Aluminum Bonding Wire for Power Devices
Copper Bonding Wire

B-6 Bumping Wires
Gold Alloy Bumping Wire
Gold Bumping Wire


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