Objective·Application Precious Metal Film Deposition Electrical Relay and Connection Technology B-1 Cross Bar Contacts B-2 Contact Welding Process B-3 Precious Metal Spring Contacts B-4 Rivet Contacts B-5 Bonding Wires B-6 Bumping Wires Joining and Precision Technology Circuits • Mounting Technology Equipment and Measuring Divices Catalysts and Compounds Precious Metal Recycling

A bumping wire can be provided for a wire bumping method to produce wireless bonded electronic equipment leading to smaller and thinner packaging with high density assembly. A bump can be formed on IC and LSI with lower cost and fewer irregularities. • Bumps can be made at chip level with a bonder. (Bumps are formed by bonding machine) • Bumps can be formed with a minimum variance in shape. • Cost effective compared with plating methods. GBC Type • Superior bonding reliability. Form of Bumps GBC Type • Suitable for a device demanding higher bonding reliability. GBE Type • No chip damage compared to Gold Alloy Bonding when the bump is formed on the pad with thin thickness metal layer. • Suitable for a device with thin thickness pad and occurring chip damage easily. Form of Bumps GBE Type Neck height

© 2004 Tanaka Kikinzoku