Objective·Application Precious Metal Film Deposition Electrical Relay and Connection Technology B-1 Cross Bar Contacts B-2 Contact Welding Process B-3 Precious Metal Spring Contacts B-4 Rivet Contacts B-5 Bonding Wires B-6 Bumping Wires Joining and Precision Technology Circuits • Mounting Technology Equipment and Measuring Divices Catalysts and Compounds Precious Metal Recycling

Bonding wires are used for a wide range of products, such as ICs, LSIs and transistors. We bring you sound products at the cutting-edge of semiconductor technology. • Meet various types of package such as DIP, SIP, QFP and BGA. • Meet latest type of package such as stacked package and super thin thickness package too. • Providing cost reduction using finer diameter with higher tensile strength wire. Correlation Between Loop Height & Breaking Load at Heated Temperature Wire Diremeter:φ30μm Stacked Multi-chip Package Wire: GMH-2 Wire diameter: 25μm 1st loop Loop length: 0.7mm Loop height (Average): 90μm 2nd loop Loop length: 2.5mm Loop height (Average): 600μm Super Low Loop Height Bonding Wire: GLF Wire diameter:25μm Loop length:3.0mm Loop height (Average) : 80μm Long Span Bonding Wire: GMH Wire diameter: 25μm Loop length: 7.0mm Pad pitch: 80μm Short Loop Length Bonding Wire: GMG Wire diameter: 25μm Loop length: 0.50mm Pad pitch: 70μm • Smaller squashed ball area. • Superior bonding reliability. • Can be used on conventional ball bonders. Bonding Reliability • The spool can be set on/off wire bonder without touching spool. • Reduces mishandling. Pull Out from Case Place on Wire-bonder TABW, TABN Type • Uniform distribution of 1% silicon. • Stable mechanical property. • Uniform wire without any curl, dirt and surface flaws. • Superior bond ability. • Better corrosion resistance (TABN type) . 18μmφ to 100μmφ TANW, TPBW Type • Excellent corrosion resistance (TANW type) . • Bonding can be performed as with conventional TPBW. • Three types of properties: Hard, Soft-1, Soft-2. 100μmφ to 500μmφ TPCW , TOCW Type • Material cost for copper is much lower than gold. 20μmφ to 50μmφ

© 2004 Tanaka Kikinzoku