Tanaka Kikinzoku Group Products Guide
Top Page Objective·Applications Contents by Industry Precious metals phyisical properties data
Objective·Application
Precious Metal Film Deposition
Electrical Relay and Connection Technology
B-1 Cross Bar Contacts
B-2 Contact Welding Process
B-3 Precious Metal Spring Contacts
B-4 Rivet Contacts
B-5 Bonding Wires
B-6 Bumping Wires
Joining and Precision Technology
Circuits • Mounting Technology
Equipment and Measuring Divices
Catalysts and Compounds
Precious Metal Recycling


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B-1 Cross Bar Contacts


Contact tapes for miniaturized relays and switches at lower cost.
Fine contact tapes for use with signal control components (miniaturized relays, switches, etc.) in electronic devices. Multilayer contacts suitable for electric loads up to several amperes produced by our exclusive precision bonding techniques.
Features
Reduces size of relays and switches.
Multilayer tapes with excellent bonding strength.
Enables combinations of materials with different properties.
*Process of sputtering is available upon request.

A Miniaturized Cross Bar Contact Tape (Example of dimensions: mm)
A Miniaturized Cross Bar Contact Tape

A Multilayer Cross Bar Contact Tape (Example of bonded materials)
A Multilayer Cross Bar Contact Tape (Example of bonded materials)

Applications
Relays, switches (for computers, telephone exchanges, household electrical appliances), etc.

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