Objective·Application Precious Metal Film Deposition A-1 Sputtering Targets and Vapor Deposition Materials A-2 Thick Film Pastes and Precious Metal Powders A-3 Various Electroplating Processes A-4 Precious Metal Clad Tapes A-5 Platinum-clad Wires Electrical Relay and Connection Technology Joining and Precision Technology Circuits • Mounting Technology Equipment and Measuring Divices Catalysts and Compounds Precious Metal Recycling		Targets Manufactured Through Melting, and Vapor Deposition Materials Electroformed Targets Precious Metal Powders for Thick Film Pastes Plating processes for semiconductor application MICROFAB Series for Au bump process LECTROLESS Series for semiconductor packaging

© 2004 Tanaka Kikinzoku