TANAKA / Precious Metal Film Deposition / A-2 Thick Film Pastes and Precious Metal Powders

Objective·Application

Precious Metal Film Deposition

	A-1 Sputtering Targets and Vapor Deposition Materials
	A-2 Thick Film Pastes and Precious Metal Powders
	A-3 Various Electroplating Processes
	A-4 Precious Metal Clad Tapes
	A-5 Platinum-clad Wires

Electrical Relay and Connection Technology

Joining and Precision Technology

Circuits • Mounting Technology

Equipment and Measuring Divices

Catalysts and Compounds

Precious Metal Recycling

Precious metal pastes have been widely used in various applications such as hybrid IC, thermal print heads, and so on. Our fine technology will deliver the best quality products for precise conductive circuit, such as LTCC.

•	Spherical powders with uniform particle size are utilized for the pastes.
•	Prices of pastes are reduced through a start-to-finish process from powder materials to the pastes.
•	Appropriate pastes are designed for a variety of applications.

Conductor Materials

Resistor Materials

Induction Materials

Hybrid IC

Ag/Pd paste

Ag/Pt past

Ag paste

Cu paste

Au paste

RuO2 resistor paste

Ag/Pd resistor paste

Crystallized dielectric paste for cross-over,

non-crystallized dielectric paste for multi-

layerprinting, non-crystallized dielectric paste

for N2 firing, dielectric paste for overcoat

Chip Resistor

Ag paste

Ag/Pd paste

RuO2 resistor paste

Ag/Pd low resistor paste

Dielectric paste for overcoat

Sensor

Pt paste

Au paste

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Lamination Ceramic Device
LTCC

Ag paste

Ag/Pt paste

Ag/Pb paste

Au paste

RuO2 resistor paste

Dielectric paste for overcoat

Tantalum Capacitor

Ag paste

Ag/Cu paste

C paste

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Thick film Thermal Print Head

Au paste

MOD/Au paste

RuO2 resistor paste

Dielectric paste for overcoat

Panel Display

Ag paste

Au paste

MOD/Au paste

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Heater

Ag/Pd paste

Ag/Pd low resistor paste

Dielectric paste for overcoat

The powders used in our pastes can produce remarkably thin and dense film. We will cope with highly diversified substrates and increasingly thin electrodes, and so on.


AY1050	AY4050	AY5022

Product Name

Tap Density
(g/ml)

Mean Particle Size*
(μm)

Specific Surface Area
(m²/g)

Platinum Powder

AY-1010

AY-1020

AY-1050

3.0~7.0

9.0~12.0

1.0~10.0

0.2~0.5

0.4~0.8

0.5~3.0

20.0~40.0

0.8~1.2

Silver Powder

AY-6010

AY-6080

0.7~1.6

3.5~4.5

6.0~13.0

0.2~1.0

1.0~2.5

1.5~3.0

Palladium Powder

AY-4030

AY-4054

0.6~1.2

4.0~7.0

1.0~7.0

0.3~1.4

9.0~16.0

0.4~1.7

Gold Powder

AY-5022

2.0~12.0

0.3~2.0

0.2~1.0

* 50% mean particle size, obtained from particle size analyzer.
Values in the above table are not specified but representative.